SBIR-STTR Award

Silicon Carbide Bipolar Junction Transistor for RF Applications
Award last edited on: 9/12/02

Sponsored Program
SBIR
Awarding Agency
DOD : OSD
Total Award Amount
$450,000
Award Phase
2
Solicitation Topic Code
OSD99-011
Principal Investigator
Richard Woodin

Company Information

Extreme Devices Inc

3500 Comsouth Drive
Austin, TX 78744
   (512) 439-3417
   N/A
   www.extremedevices.com
Location: Single
Congr. District: 35
County: Travis

Phase I

Contract Number: F33615-00-C-1602
Start Date: 12/1/99    Completed: 9/1/00
Phase I year
2000
Phase I Amount
$100,000
Silicon carbide (SiC) power transistors promise to provide higher power output with fewer, smaller devices because of the wide bandgap and high breakdown threshold of SiC. SiC bipolar junction transistors (BJTs) have received little attention due to apparent limitations of gain due ot device inefficiencies, ascribed to poor material properties. If the desired performance can be achieved, BJT's offer improved stability and higher power density than comparable field effect transistors (FETs). With only modest improvement in material properties and good esign practices, SiC BJT's for operation from 0.5-2.0 GHz can be designed. In this SBIR program Extreme Devices, in collaboration with HdB Engineering, proposes to design and fabricate high frequency (1-1.5 GHz) SiC BJT's using high power, ultra high frequency rf transistor design rules and Extreme Devices' novel supersonic molecular beam epitaxy process. The combination of device design coupled with the improved epitaxial doped SiC provided by supersonic beams will yield acceptable device performance. In Phase I demonstration SiC BJT transistors will be designed, fabricated and characterized. Phase II will design and fabricate large, high power devices and a prototype high power pulsed transmitter amplifier.

Keywords:
Transistor Electronic Materials Silicon Carbide

Phase II

Contract Number: F33615-01-C-1821
Start Date: 3/21/01    Completed: 3/21/03
Phase II year
2001
Phase II Amount
$350,000
Silicon Carbide (SiC) power transistors promise to provide higher power output with fewer, smaller devises because of the wide bandgap and high breakdon threshold of SiC. Improved material properties enable SiC bipolar junction transistors (BJTs) to be fabricated, thereby offering improved stability and higher power density than comparable field effect transistors (FETs). SiC BJT's for operation from 0.5-2.0 GHz can now be designed, suitable for military and commercial communications and radar. Extreme Devices, in collaboration with HdB Engineering, will design and fabricate high frequency (1-1.5 GHz) SiC BJT's using high power, ultra high frequency rf transistor design rules and Extreme Devices' novel supersonic molecular beam epitaxy process. In Phase I of this program Extreme Devices has designed and begun fabrication of prototype SiC bipolar junction transistors for operation above 1 GHz. A number of critical issues have been addressed, including device design, doping specification and methods for contract to the very thin base called for in the design. In phase II Extreme Devises will optimize the RF Power transistor design and processing, demonstrate improved device performance, and smaple devices to select customers.

Keywords:
Transistor, Silicon Carbide, Electronic Materials