SBIR-STTR Award

Passive thermal management through the use of ultra-high thermal conductivity fibers
Award last edited on: 7/3/2012

Sponsored Program
SBIR
Awarding Agency
DOD : Navy
Total Award Amount
$547,448
Award Phase
2
Solicitation Topic Code
N88-096
Principal Investigator
Tammy S Ebersole

Company Information

Fabric Development Inc (AKA: Textile Technologies Inc)

1217 Mill Street PO Box 462
Quakertown, PA 18951
   (215) 536-1420
   info@fabricdevelopment.com
   www.fabricdevelopment.com
Location: Multiple
Congr. District: 01
County: Bucks

Phase I

Contract Number: N88-096
Start Date: 00/00/00    Completed: 00/00/00
Phase I year
1988
Phase I Amount
$49,567
There is a great need for advanced infrared signature suppression systems in the u.s. marine corps. The existance of these signatures make the associated weapon system vulnerable to enemy attack. Most ir suppression systems available today are bulky, heavy and unacceptable for most applications especially aircraft. This effort will focus on building thermal signature suppression systems into high performance materials such as advanced composite structures. The method of suppression will be passive in nature and involve the rapid dispersion of heat so as to lower overall temperatures and to eliminate the appearance of hot spots. Aircraft structures fabricated from composite materials where the reinforcement for the composite will have extremely high thermal conductivity will be developed. The composites will not only have excellent mechanical properties but will also be able to disperse large amounts of heat, rapidly.

Phase II

Contract Number: N00164-92-C-0020
Start Date: 12/6/1991    Completed: 12/6/1993
Phase II year
1991
Phase II Amount
$497,881
The key to the success of existing and proposed future electronic systems is the effective management of thermal loads. Future electronics will have greatly increased gate densities and correspondingly increased thermal loads. Industry guidelines indicated that for current systems technology operated over military temperature ranges, an increase in electronics system reliability of up to 40% can be achieve with a 10 degree C reduction in junction temperature. This Phase II effort is directed towards the further development advanced organic matrix composites for use as thermal frames and constraining cores. In the Phase I effort, TTI successfully produced and tested organic matrix heatsink materials using Amoco's ultra-high thermal conductivity graphite fibers with both thermoplastic and thermoset matrices. Thermal conductivities in excess of 470 Watts/Meter degree K were measured. Having shown the feasibility of producing such high performance, light-weight, low CTE materials in Phase I, the Phase II effort will exploit these materials by working closely with leading electronics firms to design, fabricate and test advanced thermal frame and constraining core materials based upon the succecss of Phase I.