Transition edge sensors (TES) used in microcalorimeter arrays for X-ray photon detection are inherently susceptible to variations in the magnitude of magnetic fields since their detection principle is based on the transition between the normal and superconducting states. Optimal performance require efficient magnetic shielding to provide a low magnetic field environment. Bergen et al. provide magnetic field specifications with respect to SPON TES arrays. These specifications may become even more stringent for larger arrays. Current superconducting shield often consists of a superconducting cup arrangement as is the case proposed for the Lynx X-ray Microcalorimeter. Although this design reduces the number of joints, it is limited to the forming process and thereby the size and complexity of the shape that can be realized. Novel concepts for improving superconducting magnetic shielding such as superconducting inks or additive manufacturing are of interest for detector focal planes with challenging shielding geometries and other requirements. Novel concepts for improving superconducting magnetic shielding such as superconducting inks or additive manufacturing are of interest for detector focal planes with challenging shielding geometries and other requirements. Applied Nanotech proposes to use additive manufacturing (AM) for producing magnetic shields for shielding large and challenging shielding geometries. Our approach will be to apply a superconducting layer onto a substrate material such as amumetal, aluminum or polyimide (e.g. KaptonĀ®). Anticipated
Benefits: Currently, NASA needs advanced detector technologies in the UV through to gamma-ray for applications in astrophysics, earth science, heliophysics, and planetary science. Supporting technologies that would help enable the x-ray Surveyor mission requires the development of x-ray microcalorimeter arrays with much larger field of view, ~105 to 106 pixels, of pitch ~25 to 100 ?m, and ways to read out the signals. Modular superconducting magnetic shielding is sought that can be extended to enclose a full-scale focal plane array. Indium ink will have other applications beyond superconductivity and magnetic shielding. Indium-based inks developed for superconducting applications will also be useful as a solder and interconnects for high density, hybrid electronics packaging, for both superconducting and non-superconducting packaging applications. Quantum Computing applications are also being developed.