SBIR-STTR Award

Thermally Controlled Chip-In-Board Substrate for Integrated Circuit Packaging
Award last edited on: 3/6/02

Sponsored Program
SBIR
Awarding Agency
NASA
Total Award Amount
$70,000
Award Phase
1
Solicitation Topic Code
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Principal Investigator
William E Davis

Company Information

Fabcor (AKA: AMT Inc~Applied Material Technologies Inc)

11185 Condor Avenue
Fountain Valley, CA 92708
   (714) 545-1155
   john@fabcor.net
   www.fabcor.net
Location: Single
Congr. District: 48
County: Orange

Phase I

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase I year
1999
Phase I Amount
$70,000
The AMT Chip-In-Board (CIB) electronics packaging concept offers a high performance, low-profile thermal management solution for miniaturized, high power dissipating electronics products. The tailorable coefficient of thermal expansion (CTE) of this passive thermal management approach will also allow for high heat producing, commercial-off-the-shelf (COTS) components to be integrated into reliability-critical applications, such as military spacecraft and avionics products. The advent of faster, higher performance level lectronics components, i.e. microprocessors, has resulted in an increasing need for more effective means of removing heat from the component. Without adequate thermal management, allowing a processor chip, for instance, to operate at temperatures higher than its rated limit will result in intermittent logic errors and early failure, even sudden, irreversible failure. Conventional thermal management methods include heat sinks and heat pipes bonded to the "backside" of the heat- producing electronic component. This is often a bulky or complex result. The CIB approach will allow for a surface mount (SMT) component to be "flipped over" and either wirebonded or solder "bumped" to a circuit substrate with a high thermal conductivity core. This "flipped" SMT component will be mated directly to the core, which will provide a direct pathway for heat to escape.

Potential Commercial Applications:
The commercial potential for this extends beyond military space and avionics into high power dissipating, size-limited consumer electronics products, such as next generation notebook computers, personal communications devices, and increasingly sophisticated automobile engine, brake, and handling (i.e. accident avoidance, traction control, anti-skid) control electronics.

Phase II

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
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Phase II Amount
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