A key challenge toward future directed energy systems is the development of power and thermal management technologies needed to support the laser systems, particularly pump diodes.I2C Solutions and the University of Colorado have developed a Thermal Ground Plane (TGP) technology that interfaces with doide laser bars in order to spread heat and transport it to the laser cooling loop.During Phase II, i2C will develop and demonstrate an initial prototype diode bar array with TGPs integrated for performance improvements and the Phase II program will culminate with a demonstration and evaluation of the prototype by directed energy community leaders.Approved for Public Release 15-MDA-8169 (20 March 15)