SBIR-STTR Award

6.5 kV, 100 A SiC Power Module Technology to Meet 21st Century Energy Demands
Profile last edited on: 5/13/2022

Program
SBIR
Agency
DOE
Total Award Amount
$498,297
Award Phase
2
Principal Investigator
Adam Morgan
Activity Indicator

Company Information

Nomis Power Group LLC

22 Appletree Lane
Newtonville, NY 12110
   (518) 944-3910
   together@nomispower.com
   www.nomispower.com
Multiple Locations:   
Congressional District:   20
County:   Albany

Phase I

Phase I year
2021
Phase I Amount
$198,598
NoMIS Power Group is working to accelerate the clean tech revolution in the 21st Century by enabling the widespread adoption of SiC devices in the global power management industry. And, in the process, help develop an indigenous US-based supply chain for this critical technology, such as EV fast chargers, solid-state transformers and DC protection equipment, HVDC converters, and locomotive traction motor drives. Through this ARPA-E SEED SBIR funding, NoMIS Power Group intends to bring to market within two years SiC power semiconductor devices and modules at less than half the cost of today’s commercial-off-the-shelf-solutions. The two year goal will be achieved by sourcing chips from US suppliers, in-house development of an innovative SiC module design, and outsourced module manufacturing in the US, followed by rigorous testing by our team at leading US research institutions.

Phase II

Phase II year
2021 (last award $$: 2021)
Phase II Amount
$299,699
NoMIS Power Group is working to accelerate the clean tech revolution in the 21st Century by enabling the widespread adoption of SiC devices in the global power management industry. And, in the process, help develop an indigenous US-based supply chain for this critical technology, such as EV fast chargers, solid-state transformers and DC protection equipment, HVDC converters, and locomotive traction motor drives. Through this ARPA-E SEED SBIR funding, NoMIS Power Group intends to bring to market within two years SiC power semiconductor devices and modules at less than half the cost of today’s commercial-off-the-shelf-solutions. The two year goal will be achieved by sourcing chips from US suppliers, in-house development of an innovative SiC module design, and outsourced module manufacturing in the US, followed by rigorous testing by our team at leading US research institutions.