Shape memory materials have shown great potential in MEMS applications, including improved housing structural performance and packaging reliability. In this Phase I study, new shape memory material processing and manufacturing technology will be developed, i.e. (1) Severe deformation of CNT-SMP composites for improved CNT dispersion, to be considered for MEMS housing structure materials with high strength, self-recovery, and electromagnetic shielding functions; (2) Combined reaction synthesis and forming for low-temperature/low energy processing of SMA and composites at low cost and improved performance, to be considered for MEMS structures and actuator components. The project will also develop understanding of the deformation process of SMM at the molecular, microstructural and macro scales, and will integrate the knowledge in mechanics, physics, chemistry and thermodynamics to build a solid scientific and experimental foundation towards innovative new MEMS material processing techniques. The proposed approach and objectives, if successful, will resolve critical issues of MEMS packaging performance and reliability and will provide low-cost and high efficiency SMM manufacturing methods.
Benefits:Implementing the results from this project will allow (1) the specifications for MEMS packaging defined by Army project solicitation to be achieved, including: - Humidity: 96-1000 hrs between 60 to 85C with 85 to 90% relative humidity; - Impact tests: 1-5 drops at 1 meter height with no performance degradation to the device; - Mechanical shock: 5g-100g pulses at 10msec durations; - Electromagnetic compatibility: 50-200 V/m at 1-1000 MHz; - Hermetic sealing: able to withstand pressures ranging from 15-250 kPa. (2) Develop a newcarbon nanotube dispersion technique that can significantly enhance shape memory polymer strength and achieve electromagnetic shielding; (3) Develop a new shape memory alloy (SMA) and SMA metal composite technique by low temperature reaction synthesize, equal channel angular extrusion (ECAE) and superplastic forming. The reaction synthesis process can greatly reduce SMA manufacturing cost. The ECAE process can obain fine-grained bulk materials (in nano to submicron size) that provide superplasticity and superior mechanical properties. (4) In addition, the understanding developed from this project will greatly advance the MEMS material processing and packaging technology, with improved performance, low manufacturing cost, and other enviromental benefits to society.
Keywords:MEMS packaging, shape memory alloy, shape memory polymer, nano composite, material processing, manufacture, reliability
