Development of novel curing techniques for thermosetting polymers and adhesives
Award last edited on: 12/16/2002

Sponsored Program
Awarding Agency
DOD : Army
Total Award Amount
Award Phase
Solicitation Topic Code
Principal Investigator
Bernard Baum

Company Information

Springborn Laboratories Inc (AKA: Springborn Materials Science, Inc.)

10 Springborn Center
Enfield, CT 06082
   (203) 749-8371
Location: Single
Congr. District: 02
County: Hartford

Phase I

Contract Number: DAAK70-88-C-0015
Start Date: 00/00/00    Completed: 00/00/00
Phase I year
Phase I Amount
The main objective of this program is to determine the feasibility of developing a thermosetting polymeric adhesive and curing method that will not require cure cycles in an oven or a press at elevated temperatures and pressures. The program will encompass a study of the responsiveness of thermosetting epoxy adhesives to dielectric, induction, ultrasonic, ultre-violet, and infrared electromagnetic energies. Energy sensitizers will be investigated for improving the adhesive's responsiveness towards energies showing limited effects. A final evaluation of the physical properties relating to the cure of the adhesive will be used to determine feasibility of developing a nove curing thermosetting polymeric adhesive.

Phase II

Contract Number: 90-C-0030
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
Phase II Amount
The objective of Phase II is to further develop the radio frequency, induction, resistance, infrared and ultraviolet methods shown to be feasible in Phase I for accelerating the cure of thermosetting epoxy adhesives. The program will address adhesive selection and process optimization to the extent that an adhesive and rapid curing technique is proven suitable for tactical bridge manufacture or field repair.