In June 2005 Sensant Corporation was acquired by the German Medical giant Siemens AG. Combining the benefits of state-of-the-art MEMS (Micro Electro Mechanical Systems) technology with the potential of on-chip electronics, Sensant's Silicon Ultrasound(tm) transducers deliver revolutionary improvements in performance and cost and represent a major advance in ultrasonic sensing. Using a technique known as surface micromachining, Sensant's transducers are built on the surface of silicon wafer and resemble tiny percussion drums. When these drums are beatenelectronically, they generate high-frequency sound waves. Conversely, when sound waves impinge upon the drums, they vibrate the drum membrane and produce a received electrical signal. Sensant has designed air and immersion transducers using its advanced MEMS technology. These transducers are suitable for one and two-dimensional arrays and offer superior bandwidth, high frequencies, small size and volume pricing. And because these transducers are made on a silicon wafer, integration with semiconductor electronics is possible, thereby opening up exciting new opportunities
