SBIR-STTR Award

Automated In-situ Large-area De-processing of ICs with High Throughput
Award last edited on: 7/22/2021

Sponsored Program
STTR
Awarding Agency
DOD : DMEA
Total Award Amount
$1,149,609
Award Phase
2
Solicitation Topic Code
DMEA18B-001
Principal Investigator
Michael Strizich

Company Information

Micronet Solutions Inc

10501 Research Road SE Suite C
Albuquerque, NM 87123
   (505) 765-2495
   info@micronetsol.net
   www.micronetsol.net

Research Institution

University of Florida

Phase I

Contract Number: HQ072719P0020
Start Date: 3/2/2019    Completed: 9/15/2019
Phase I year
2019
Phase I Amount
$149,971
The objective of this proposal is to demonstrate the feasibility of producing an automated delayering and imaging system with end point detection, material density detection with built in neural network error correction. This process, coined fast Automated Delayering-Image Capture System (ADICS) leverages off of the existing Pix2Net which is a proven automated imaging 3D microchip reconstruction software suite. This will provide a fast track to a system that automates both the delayering and imaging in situ with initial feasibility studies done on commercially available dual beam Focused Ion Beam (FIB) / Scanning Electron Microscope (SEM) system, and more specialized wide spot FIB systems. MSI’s proven reverse engineering workflow and existing Pix2Net™ software tool suite has enabled rapid extraction of IC feature sets to form a comprehensive ‘signature’ for IP analysis verification, complete GDS II and design extractions. Despite this success, automated delayering of the microchip has been elusive. A significant opportunity exists leveraging off of the existing Pix2Net™ software suite, were the in situ removal of layers, end point detection, and image capture can be automated and incorporated into a new API leveraging off of the Pix2Net™ workflow.

Phase II

Contract Number: HQ072720C0005
Start Date: 3/18/2020    Completed: 3/31/2022
Phase II year
2020
Phase II Amount
$999,638
Phase II is the continuing effort to demonstrate the feasibility of producing an automated delayering and imaging system with end point detection, material density detection with built in neural network error correction. This process, coined fast Automated Delayering-Image Capture System (ADICS) leverages off of the existing Pix2Net which is a proven automated imaging 3D microchip reconstruction software suite. This will provide a fast track to a system that automates both the delayering and imaging in situ with initial feasibility studies done on commercially available dual beam Focused Ion Beam (FIB) / Scanning Electron Microscope (SEM) system, and more specialized wide spot FIB systems. MSI’s proven reverse engineering workflow and existing Pix2Net™ software tool suite has enabled rapid extraction of IC feature sets to form a comprehensive ‘signature’ for IP analysis verification, complete GDS II and design extractions. Despite this success, automated delayering of the microchip has been elusive. A significant opportunity exists leveraging off of the existing Pix2Net™ software suite, were the in situ removal of layers, end point detection, and image capture can be automated and incorporated into a new API leveraging off of the Pix2Net™ workflow