The increasing complexity of devices, reduced budgets and accelerated program timelines, requires a new approach to predicting radiation of integrated circuit (IC) designs. Most approaches to date require gate level analysis and do not scale easily to device level calculations, leading to methods that are not practical under most program timeline and cost budgets. Previously, DfR Solutions has demonstrated a functional group approach to integrated circuit wearout that has greatly accelerated analysis and made such an exercise more accessible to industry by drastically reducing time and cost. Similarly, DfR Solutions will adapt the functional group methodologies to streamline radiation reliability analysis of an entire complex integrated circuit device. In addition to reducing the analysis burden, DfR Solutions will use their physics of failure, modeling and tool creation experience to build the tool to accept input from traditional industry data sources. This will accelerate the user experience by pre-populating many of the required parameters for analysis with industry accepted values. Successful past efforts have refined industry prediction algorithms, created linkages to standard data packages for input and developed practical software packages suitable for design analysis that reduce program cost, timeline and risk.
