High temperature deformation and strain are important measures for characterizing behaviors of structural components under high temperature condition. Measuring full-field, high temperature deformation and strain can lead to a better understanding structural and material response, damage initiation, progressive damage, and ultimately limit state attainment in moderately high temperature material systems. Although CAD software and finite element modeling are useful for modeling and simulating high temperature deformation and strain, those models need to be validated by accurate measurements with proper boundary conditions and material properties. It is therefore critical to experimentally measure full-field, high temperature strain and displacement. In this proposal, Intelligent Automation Inc. (IAI) and Prof. Lianxiang Yang from Oakland University propos to develop an innovative Monochromatic Light Illuminated High-Speed Digital Image Correlation (MLI-HS-DIC) System for full-field, high temperature strain and displacement measurement. The success of the proposed effort will result in the development of a novel technique that will provide rapid and accurate measurement strain and displacement under high temperature conditions.
Benefit: The capture of a full-field strain and displacement of a structure/object under test is vitally important for validating modeling and simulation results. Measurements of full-field strain/stress and displacement under high temperature post significantly greater challenge and interest to broad scientific and engineering communities. This is because the high-temperature full-field strain/stress and displacement data is invaluable for gaining understanding of structural and material response, damage initiation, progressive damage, and ultimately limit state attainment in moderately high temperature material systems. The proposed research provides great support for validation and optimization of design data and CAD models as well as for improvement of product quality, and, thus, for enhancement of the lifetime and durability, and for reduction of the risk of failure of products.
Keywords: Digital Image Correlation, Full-Field Strain, High Temperature, High Speed Imaging
